Thermal Management in Power Electronics

Understand the principles of heat generation and dissipation in power electronics.

Sources of heat in power electronic devices: conduction losses, switching losses. Thermal resistance, thermal impedance, and junction temperature. Impact of temperature on device performance, reliability, and lifespan.

Learn the key techniques for effective thermal management.

Passive cooling methods: conduction, convection, and radiation. Active cooling methods: forced air cooling, liquid cooling, thermoelectric cooling. Role of airflow management and heat dissipation in system design. Design considerations for minimizing thermal resistance.

Identify and evaluate materials used for heat dissipation.

Thermal conductivity of materials: metals (aluminum, copper), ceramics, polymers. Use of thermal interface materials (TIMs): thermal pastes, pads, and adhesives. Phase change materials (PCMs) for transient thermal management. Selection criteria for thermal materials based on application requirements.

Understand the design and application of heat sinks and thermal interfaces.

Types of heat sinks: extruded, stamped, bonded fin, and liquid-cooled. Heat sink design parameters: surface area, fin design, airflow considerations. Thermal interface design: contact resistance, material selection, and application techniques. Mounting methods and integration of heat sinks with power devices.

Explore advanced cooling methods and technologies.

Liquid cooling systems: cold plates, heat exchangers, and liquid immersion. Heat pipes and vapor chambers for efficient heat transfer. Thermoelectric coolers (TECs) and their applications in precision cooling. Emerging cooling technologies: microchannel cooling, nanofluids, and phase change cooling.

Implement and analyse thermal management strategies in practical applications.

Thermal modelling and simulation tools for power electronics. Testing and measurement techniques: thermal imaging, thermocouples, and IR sensors. Case studies: thermal management in high-power converters, inverters, and automotive electronics. Troubleshooting thermal issues: hotspot detection, mitigation strategies, and design optimization.